- Title
- Ear in the sky : terrestrial mobile jamming to prevent aerial eavesdropping
- Creator
- Wang, Qubeijian; Liu, Yalin; Dai, Hong-Ning; Imran, Muhammad; Nasser, Nidal
- Date
- 2021
- Type
- Text; Conference paper
- Identifier
- http://researchonline.federation.edu.au/vital/access/HandleResolver/1959.17/188232
- Identifier
- vital:17251
- Identifier
-
https://doi.org/10.1109/GLOBECOM46510.2021.9685471
- Identifier
- ISBN:9781728181042 (ISBN)
- Abstract
- The emerging unmanned aerial vehicles (UAVs) pose a potential security threat for terrestrial communications when UAVs can be maliciously employed as UAV-eavesdroppers to wiretap confidential communications. To address such an aerial security threat, we present a friendly jamming scheme named terrestrial mobile jamming (TMJ) to protect terrestrial confidential communications from UAV eavesdropping. In our TMJ scheme, a jammer moving along the protection area can emit jamming signals toward the UAV-eavesdropper so as to reduce the eavesdropping risk. We evaluate the performance of our scheme by analyzing a secrecy-capacity maximization problem subject to the legitimate connectivity and eavesdropping probability. In addition, we investigate the optimized position for the jammer as well as its jamming power. Simulation results verify the effectiveness of the proposed scheme. © 2021 IEEE.
- Publisher
- Institute of Electrical and Electronics Engineers Inc.
- Relation
- 2021 IEEE Global Communications Conference, GLOBECOM 2021, Madrid, 7-11 December 2021, 2021 IEEE Global Communications Conference, GLOBECOM 2021 - Proceedings
- Rights
- All metadata describing materials held in, or linked to, the repository is freely available under a CC0 licence
- Rights
- Copyright © 2021 IEEE.
- Subject
- Simulation; Conferences; Ear; Autonomous aerial vehicles; Security; Global communication; Jamming
- Reviewed
- Funder
- Shanghai Sailing Program under Grant No. 21YF1451100, Fundamental Research Funds for the Central Universities under Grant No. D5000210591, Macao Science and Technology Development Fund under Grant No. 0026/2018/A1 Hong Kong Institute of Business Studies (HKIBS) Research Seed Fund with Grant No. HKIBS RSF-212-004.
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